Ultra Thin Board Heavy Copper

Layer Count ： 8
Material ：FR4 High TG
Thickness：1.35mm/2.0mm
Dimension：65 x 52mm/70 x 58mm
Surface Finish：Gold Plating
Min. Hole Size：0.75 mm/1.0 mm
Application：Power Supply
Special Feature：6OZ copper, Core is ultra thin, required precision inner layer manufacture and registration capabilities,and both high-pot test and thermal shock reliability can meet requirement